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NCV8843 Datasheet PDF : 18 Pages
First Prev 11 12 13 14 15 16 17 18
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC 16 LEAD WIDE BODY, EXPOSED PAD
CASE 751R02
ISSUE B
SCALE 1:1
U
A
M
16
P
0.25 (0.010) M W M 1
9
B
8
W
PIN 1 I.D.
G 14 PL
TOP SIDE
R x 45_
DETAIL E
0.10 (0.004) T
D 16 PL
0.25 (0.010) M
C
T
K SEATING
PLANE
T U S WS
H
F
J
DETAIL E
1
EXPOSED PAD
16
8
L
9
DATE 18 JUL 2005
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL BE
0.13 (0.005) TOTAL IN EXCESS OF THE D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
6. 751R-01 OBSOLETE, NEW STANDARD 751R-02.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 10.15 10.45 0.400 0.411
B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F 0.50 0.90 0.020 0.035
G
1.27 BSC
0.050 BSC
H 3.31 3.51 0.130 0.138
J 0.25 0.32 0.010 0.012
K 0.10 0.25 0.004 0.009
L 4.58 4.78 0.180 0.188
M 0_ 7_ 0_ 7_
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
MARKING
DIAGRAM
BACK SIDE
SOLDERING FOOTPRINT*
.350
.175
.050
Exposed
Pad
.200
.07
4
CL
.18
8
CL
.376
xxxxxxxxxx
xxxxxxxxxx
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AWLYYWW
xxx = Specific Device Code
A
= Assembly Location
WL = Wafer Lot
YY
= Year
WW = Work Week
.024
.145
SCALE 2:1
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON10370D
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
SOIC16, WB EXPOSED PAD
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com

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