NCV8660B(2010) Ver la hoja de datos (PDF) - ON Semiconductor
Número de pieza
componentes Descripción
Lista de partido
NCV8660B
(Rev.:2010)
(Rev.:2010)
ON Semiconductor
NCV8660B Datasheet PDF : 12 Pages
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100
0.5
0.2
10
0.1
0.05
0.02
1 0.01
Single Pulse
0.1
0.01
0.001
0.000001 0.00001
NCV8660B
180
170
160
150
140
130
120
110
100
90
80
0
1.3
Power curve with PCB 1 oz cu
1.2
1.1
1.0
0.9
Theta JA curve
0.8
100 200 300 400 500 600
COPPER HEAT SPREADER AREA (mm2)
Figure 26. RqJA vs. PCB Copper Area
0.7
700
Psi L−A
0.0001
0.001
0.01
0.1
PULSE TIME (sec)
1
10
Figure 27. Transient Thermal Response
Cu Area = 645 mm2
100
1000
ORDERING INFORMATION
Device
Output Voltage
Reset Delay Time,
DT to GND
Reset Delay Time,
DT to OUT
Package
Shipping†
NCV86601BD50R2G
8 ms
128 ms
NCV86602BD50R2G
NCV86603BD50R2G
5.0 V
8 ms
16 ms
32 ms
64 ms
NCV86604BD50R2G
NCV86601BD33R2G
32 ms
8 ms
128 ms
128 ms
SOIC−8 FUSED
(Pb−Free)
2500 / Tape & Reel
NCV86602BD33R2G
NCV86603BD33R2G
3.3 V
8 ms
16 ms
32 ms
64 ms
NCV86604BD33R2G
32 ms
128 ms
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
http://onsemi.com
11
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