NCV86604BD33R2G Ver la hoja de datos (PDF) - ON Semiconductor
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NCV86604BD33R2G Datasheet PDF : 14 Pages
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NCV8660B
PACKAGE DIMENSIONS
DPAK 5, CENTER LEAD CROP
CASE 175AA
ISSUE B
B
V
R
−T−
SEATING
PLANE
C
E
A
S
12 3 4 5
U
K
F
J
L
H
D 5 PL
G
0.13 (0.005) M T
R1
Z
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
A 0.235 0.245
B 0.250 0.265
C 0.086 0.094
D 0.020 0.028
E 0.018 0.023
F 0.024 0.032
G 0.180 BSC
H 0.034 0.040
J 0.018 0.023
K 0.102 0.114
L 0.045 BSC
R 0.170 0.190
R1 0.185 0.210
S 0.025 0.040
U 0.020 −−−
V 0.035 0.050
Z 0.155 0.170
MILLIMETERS
MIN MAX
5.97 6.22
6.35 6.73
2.19 2.38
0.51 0.71
0.46 0.58
0.61 0.81
4.56 BSC
0.87 1.01
0.46 0.58
2.60 2.89
1.14 BSC
4.32 4.83
4.70 5.33
0.63 1.01
0.51 −−−
0.89 1.27
3.93 4.32
SOLDERING FOOTPRINT*
6.4
0.252
2.2
0.086
5.8
0.228
0.34 5.36
0.013 0.217
10.6
0.417
0.8
0.031
ǒ Ǔ SCALE 4:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
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