NCV86604BD33R2G Ver la hoja de datos (PDF) - ON Semiconductor

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NCV86604BD33R2G

Very Low Iq LD0 150 mA Regulator with RESET and Delay Time Select

ON Semiconductor 

NCV8660B

ABSOLUTE MAXIMUM RATINGS

Rating

Symbol

Min

Max

Unit

Input Voltage (IN)

Input Current

Output Voltage (OUT)

DC

Transient, t < 10 s (Note 1)

VIN

IIN

VOUT

−0.3

−1.0

−0.3

−0.3

40

V

−

mA

V

5.5

16

Output Current (OUT)

IOUT

−1.0

Current

mA

Limited

Storage Temperature Range

DT (Reset Delay Time Select) Voltage (Note 2)

DT (Reset Delay Time Select) Current (Note 2)

RO (Reset Output) Voltage

DC

Transient, t < 10 s

TSTG

VDT

IDT

VRO

−55

−0.3

−1.0

−0.3

−0.3

150

°C

16

V

1.0

mA

V

5.5

16

RO (Reset Output) Current

ESD CAPABILITY

IRO

−1.0

1.0

mA

ESD Capability, Human Body Model (Note 3)

ESD Capability, Machine Model (Note 3)

ESD Capability, Charged Device Model (Note 3)

THERMAL RESISTANCE

ESDHB

ESDMM

ESDCDM

−2.0

−200

−1.0

2.0

kV

200

V

1.0

kV

Junction−to−Case (Note 4)

Junction−to−Ambient (Note 4)

Junction−to−Tab (Note 4)

Junction−to−Ambient (Note 4)

Junction−to−Lead (pin 6) (Note 4)

LEAD SOLDERING TEMPERATURE AND MSL

DPAK 5

DPAK 5

DPAK 5

SOIC−8 FUSED

SOIC−8 FUSED

RqJC

RqJA

RqJT

RqJA

RqJT

15

°C/W

66

°C/W

4.0

°C/W

104

°C/W

33

°C/W

Moisture Sensitivity Level

DPAK 5

MSL

1

−

SOIC−8 FUSED

3

Lead Temperature Soldering: SMD style only, Reflow (Note 5)

Pb−Free Part 60 − 150 sec above 217°C, 40 sec max at peak

SLD

−

265 peak

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. The output voltage must not exceed the input voltage.

2. External resistor required to minimize current to less than 1 mA when the control voltage is above 16 V.

3. This device series incorporates ESD protection and is tested by the following methods:

ESD HBM tested per AEC−Q100−002 (EIA/JESD22−A114)

ESD MM tested per AEC−Q100−003 (EIA/JESD22−A115)

ESD CDM tested per EIA/JESD22/C101, Field Induced Charge Model

4. Values represented typical steady−state thermal performance on 1 oz. copper FR4 PCB with 1 in2 copper area.

5. Per IPC / JEDEC J−STD−020C.

OPERATING RANGE

Pin Symbol, Parameter

VIN, Input Voltage Operating Range

Junction Temperature Range

Symbol

Min

VIN

4.5

TJ

−40

Max

Unit

40

V

150

°C

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