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NCV8674DS120G Ver la hoja de datos (PDF) - ON Semiconductor

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NCV8674DS120G
ON-Semiconductor
ON Semiconductor ON-Semiconductor
NCV8674DS120G Datasheet PDF : 12 Pages
First Prev 11 12
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
D2PAK
CASE 93603
ISSUE E
SCALE 1:1
K
A
T
T
TERMINAL 4
C
C
OPTIONAL
CHAMFER
ED
U
OPTIONAL
CHAMFER
ES
S
B
H DETAIL C
12 3
V
DETAIL C
J
F
G
2X D
SIDE VIEW
DUAL GAUGE
CONSTRUCTION
TOP VIEW 0.010 (0.254) M T
BOTTOM VIEW
SIDE VIEW
SINGLE GAUGE
CONSTRUCTION
N
R
T
M
P
L
DETAIL C
SEATING
PLANE
BOTTOM VIEW
OPTIONAL CONSTRUCTIONS
DATE 29 SEP 2015
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCHES.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 4.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
6. SINGLE GAUGE DESIGN WILL BE SHIPPED AF­
TER FPCN EXPIRATION IN OCTOBER 2011.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.386 0.403 9.804 10.236
B 0.356 0.368 9.042 9.347
C 0.170 0.180 4.318 4.572
D 0.026 0.036 0.660 0.914
ED 0.045 0.055
ES 0.018 0.026
F 0.051 REF
1.143 1.397
0.457 0.660
1.295 REF
G 0.100 BSC
2.540 BSC
H 0.539 0.579 13.691 14.707
J 0.125 MAX
3.175 MAX
K 0.050 REF
1.270 REF
L 0.000 0.010 0.000 0.254
M 0.088 0.102 2.235 2.591
N 0.018 0.026 0.457 0.660
P 0.058 0.078 1.473 1.981
R
0_
8_
0_
8_
S
0.116 REF
2.946 REF
U
0.200 MIN
5.080 MIN
V
0.250 MIN
6.350 MIN
SOLDERING FOOTPRINT*
10.490
GENERIC
MARKING DIAGRAM*
16.155
8.380
2X
3.504
2X 1.016
5.080
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
XXXXXXG
ALYWW
XXXXXX = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
WW = Work Week
G
= PbFree Package
*This information is generic. Please refer to
device data sheet for actual part marking.
PbFree indicator, “G” or microdot “ G”,
may or may not be present.
DOCUMENT NUMBER: 98ASH01005A
DESCRIPTION: D2PAK
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
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