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WF128K32-XXX5 Datasheet PDF : 16 Pages
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WF128K32-XXX5
128KX32 5V FLASH MODULE, SMD 5962-94716
FEATURES
n Access Times of 50*, 60, 70, 90, 120, 150ns
n Packaging:
•66 pin, PGA Type, 1.075 inch square, Hermetic
Ceramic HIP (Package 400)
•68 lead, Hermetic CQFP (G2U)1, 22.4mm (0.880 inch)
square, 3.56mm (0.140 inch) high (Package 510)
•68 lead, Hermetic CQFP (G1U), 23.9mm (0.940 inch)
square, 3.56mm (0.140 inch) high (Package 519)
•68 lead, Hermetic CQFP (G1T), 23.9mm (0.940 inch)
square, 4.06mm (0.160 inch) high (Package 524)
n Sector Architecture
•8 equal size sectors of 16KBytes each
•Any combination of sectors can be concurrently
erased.
Also supports full chip erase
n 100,000 Erase/Program Cycles Typical, 0°C to +70°C
n Organized as 128Kx32
n Commercial, Industrial and Military Temperature Ranges
n 5 Volt Programming. 5V ± 10% Supply
n Low Power CMOS, 1mA Standby Typical
n Embedded Erase and Program Algorithms
n TTL Compatible Inputs and CMOS Outputs
n Built-in Decoupling Caps and Multiple Ground Pins for
Low Noise Operation
n Page Program Operation and Internal Program Control
Time
n Weight
WF128K32-XG1UX5 - 5 grams typical
WF128K32-XG1TX5 - 5 grams typical
WF128K32-XG2UX51 - 8 grams typical
WF128K32-XH1X5 - 13 grams typical
Note 1: Package Not Recommended For New Design
Note: For programming information refer to Flash Programming 1M5
Application Note.
* The access time of 50ns is available in Industrial and Commercial temperature
ranges only.
FIG. 1 PIN CONFIGURATION FOR WF128K32N-XH1X5
TOP VIEW
PIN DESCRIPTION
I/O0-31 DataInputs/Outputs
A0-16
Address Inputs
WE1-4
Write Enables
CS1-4
Chip Selects
OE
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
BLOCK DIAGRAM
December 2001 Rev. 4
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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