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4263 Datasheet PDF : 4 Pages
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PE4263
Product Specification
Table 3. Absolute Maximum Ratings
Symbol
Parameter/Conditions
Min Max Units
VDD
Power supply voltage
VI
Voltage on any input
-0.3 4.0
V
-0.3
VDD+
0.3
V
TST
Storage temperature range
-65 +150 °C
TOP
Operating temperature range -40 +85
°C
TX input power (50 Ω)1
PIN
RX input power (50 Ω)1
+38
dBm
+23
ESD Voltage (HBM, MIL_STD
883 Method 3015.7)
ESD Voltage (MM, JEDEC,
JESD22-A114-B)
VESD
ESD Voltage (CDM, JEDEC,
JESD22-C101-A)
ESD Voltage at ANT Port
(IEC 61000-4-2)
Note: 1. Max RF specified with VDD applied
1500 V
100
V
2000 V
1700 V
Absolute Maximum Ratings are those values
listed in the above table. Exceeding these values
may cause permanent device damage.
Functional operation should be restricted to the
limits in the DC Electrical Specifications table.
Exposure to absolute maximum ratings for
extended periods may affect device reliability.
Table 4. DC Electrical Specifications
Parameter
Min
Typ
Max Units
VDD Supply Voltage
2.4
2.6
2.8
V
IDD Power Supply Current
(VDD = 2.6V)
13
20
µA
Control Voltage High
0.7 x VDD
V
Control Voltage Low
0.3 x VDD
V
Table 5. Truth Table
Path
ANT – RX1
ANT – RX2
ANT – RX3
ANT – RX4
ANT - TX1
ANT - TX2
V3
V2
V1
0
0
0
0
0
1
0
1
0
0
1
1
1
0
x
1
1
x
Electrostatic Discharge (ESD) Precautions
When handling this UltraCMOS™ device, observe
the same precautions that you would use with other
ESD-sensitive devices. Although this device
contains circuitry to protect it from damage due to
ESD, precautions should be taken to avoid
exceeding the specified rating.
Latch-Up Avoidance
Unlike conventional CMOS devices, UltraCMOS™
devices are immune to latch-up.
Table 6. Ordering Information
Order Code
4263-92
4263-98
4263-10
Die ID
C9797_3
C9797_3
C9797_3
Description
PE4263-DIE-D
PE4263-DIE-400G
PE4263-DIE-1H
Package
Film Frame
Waffle Pack
Evaluation Kit
Shipping Method
Wafer (Gross Die / Wafer Quantity)
400 Dice / Waffle Pack
1/ box
Document No. 70-0175-02 │ www.psemi.com
NDA required for full version: contact sales@psemi.com
©2005 Peregrine Semiconductor Corp. All rights reserved.
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