RF2192PCBA-41X Ver la hoja de datos (PDF) - RF Micro Devices
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RF2192PCBA-41X Datasheet PDF : 12 Pages
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RF2192
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Pkg
Base
Function
GND
GND
GND
RF IN
Description
Ground connection.
Ground connection.
Ground connection.
RF input. An external 100pF series capacitor is required as a DC block. In
addition, shunt inductor and series capacitor are required to provide
2:1 VSWR.
Interface Schematic
RF IN
100 pF
VCC1
From
Bias GND1
Stages
VREG1
VMODE
VREG2
BIAS GND
GND
RF OUT
Power Down control for first stage. Regulated voltage supply for amplifier
bias. In Power Down mode, both VREG and VMODE need to be LOW (<0.5V).
For nominal operation (High Power Mode), VMODE is set LOW. When set
HIGH, the driver and final stage are dynamically scaled to reduce the
device size and as a result to reduce the idle current.
Power Down control for the second stage. Regulated voltage supply for
amplifier bias. In Power Down mode, both VREG and VMODE need to be LOW
(< 0.5 V).
Bias circuitry ground. See application schematic.
Ground connection.
RF output and power supply for final stage. This is the unmatched collector
output of the second stage. A DC block is required following the matching
components. The biasing may be provided via a parallel L-C set for reso-
nance at the operating frequency of 824MHz to 849MHz. It is important to
select an inductor with very low DC resistance with a 1A current rating.
Alternatively, shunt microstrip techniques are also applicable and provide
very low DC resistance. Low frequency bypassing is required for stability.
RF OUT
From Bias
S ta g e s
RF OUT
RF OUT
2FO
VCC BIAS
VCC1
VCC1
GND
Same as pin 10.
See pin 10.
Same as pin 10.
Harmonic trap. This pin connects to the RF output but is used for providing
a low impedance to the second harmonic of the operating frequency. An
inductor or transmission line resonating with an on chip capacitor at 2fo is
required at this pin.
Power supply for bias circuitry. A 100pF high frequency bypass capacitor is
recommended.
Power supply for first stage.
Same as Pin 15.
Ground connection. The backside of the package should be soldered to a
top side ground pad which is connected to the ground plane with multiple
vias. The pad should have a short thermal path to the ground plane.
Rev A8 DS060918
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
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