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RT8010 Ver la hoja de datos (PDF) - Richtek Technology

Número de pieza
componentes Descripción
Lista de partido
RT8010 Datasheet PDF : 15 Pages
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RT8010/A
Parameter
Symbol
Test Conditions
Min
Output Voltage
Accuracy
Fix
Output Voltage
Accuracy
Adjustable
FB Input Current
ΔVOUT
ΔVOUT
ΔVOUT
IFB
VIN = VOUT + ΔV to 5.5V
VIN = VOUT + ΔV to 5.5V
VIN = VOUT + ΔV to 5.5V
0A < IOUT < 1A
VFB = VIN
(Note 5) 3
(Note 5) 3
(Note 5) 3
50
PMOSFET RON
VIN = 3.6V
--
RDS(ON)_P IOUT = 200mA
VIN = 2.5V
--
NMOSFET RON
VIN = 3.6V
--
RDS(ON)_N IOUT = 200mA
VIN = 2.5V
--
P-Channel Current Limit
ILIM_P
VIN = 2.5V to 5.5 V
1.4
EN High-Level Input Voltage
VEN_H
VIN = 2.5V to 5.5V
1.5
EN Low-Level Input Voltage
VEN_L
VIN = 2.5V to 5.5V
--
Under Voltage Lock Out threshold UVLO
--
Hysteresis
--
Oscillator Frequency
fOSC
VIN = 3.6V, IOUT = 100mA
1.2
Thermal Shutdown Temperature TSD
--
Max. Duty Cycle
100
LX Leakage Current
VIN = 3.6V, VLX = 0V or VLX = 3.6V 1
Typ
--
--
--
--
0.28
0.38
0.25
0.35
1.5
--
--
1.8
0.1
1.5
160
--
--
Max Units
+3 %
+3 %
+3 %
50 nA
--
Ω
--
--
Ω
--
--
A
--
V
0.4
--
V
--
V
1.8 MHz
-- °C
--
%
1 μA
Note 1. Stresses listed as the above Absolute Maximum Ratingsmay cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. Devices are ESD sensitive. Handling precaution recommended.
Note 3. The device is not guaranteed to function outside its operating conditions.
Note 4. θJA is measured in the natural convection at TA = 25°C on a high effective four layers thermal conductivity test board of
JEDEC 51-7 thermal measurement standard. The case point of θJC is on the expose pad for the QFN package.
Note 5. ΔV = IOUT x PRDS(ON)
Note 6. Guarantee by design.
DS8010/A-02 March 2007
www.richtek.com
5

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