RT8270 Ver la hoja de datos (PDF) - Richtek Technology
Número de pieza
componentes Descripción
Lista de partido
RT8270 Datasheet PDF : 12 Pages
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RT8270
Parameter
Symbol
Test Conditions
Min Typ Max Unit
Shutdown Current
Quiescent Current
Thermal Shutdown
ISHDN
IQ
TSD
VEN = 0V
VEN = 2V, VFB = 1.5V
--
25 50 μA
-- 0.7 1 mA
--
150 --
°C
Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. θJA is measured in the natural convection at TA = 25°C on a high effective four layers thermal conductivity test board of
JEDEC 51-7 thermal measurement standard.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
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DS8270-01 March 2011
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