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RTL8101 Ver la hoja de datos (PDF) - Unspecified

Número de pieza
componentes Descripción
Lista de partido
RTL8101 Datasheet PDF : 68 Pages
First Prev 61 62 63 64 65 66 67 68
13. Dimensions
RTL8101L
Symbol Dimension in Dimension in
inch
mm
Min Nom Max Min Nom Max
A
- - 0.067 - - 1.70
A1 0.000 0.004 0.008 0.00 0.1 0.20
A2 0.051 0.055 0.059 1.30 1.40 1.50
B 0.006 0.009 0.011 0.15 0.22 0.29
b1 0.006 0.008 0.010 0.15 0.20 0.25
C 0.004 - 0.008 0.09 - 0.20
c1 0.004 - 0.006 0.09 - 0.16
D
0.630 BSC
16.00 BSC
D1
0.551 BSC
14.00 BSC
E
0.630 BSC
16.00 BSC
E1
0.551 BSC
14.00 BSC
0.020 BSC
0.50 BSC
L 0.016 0.024 0.031 0.40 0.60 0.80
L1
0.039 REF
1.00 REF
θ 0° 3.5° 9° 0° 3.5° 9°
θ1 0° - - 0° - -
θ2
12°TYP
12°TYP
θ3
12°TYP
12°TYP
Note:
1.To be determined at seating plane -c-
2.Dimensions D1 and E1 do not include mold protrusion.
D1 and E1 are maximum plastic body size dimensions
including mold mismatch.
3.Dimension b does not include dambar protrusion.
Dambar can not be located on the lower radius of the foot.
4.Exact shape of each corner is optional.
5.These dimensions apply to the flat section of the lead
between 0.10 mm and 0.25 mm from the lead tip.
6. A1 is defined as the distance from the seating plane
to the lowest point of the package body.
7.Controlling dimension: millimeter.
8. Reference document: JEDEC MS-026 , BED.
TITLE: 100LD LQFP ( 14x14x1.4mm)
PACKAGE OUTLINE DRAWING , FOOTPRINT 2.0mm
LEADFRAME MATERIAL:
APPROVE
DOC. NO.
VERSION 1
PAGE
OF
CHECK
DWG NO. LQ100 - P1
DATE
REALTEK SEMICONDUCTOR CORP.
2003-05-28
67
Rev.1.3

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