SC1159 Ver la hoja de datos (PDF) - Semtech Corporation
Número de pieza
componentes Descripción
Lista de partido
SC1159
Semtech Corporation
SC1159 Datasheet PDF : 20 Pages
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POWER MANAGEMENT
Pin Configuration
Top View
SC1159
Ordering Information
Device (1)
SC1159SWTR
Package
SO-28
Temp Range (TJ)
0° to 125°C
SC1159EVB
Evaluation Board
Note:
(1) Only available in tape and reel packaging. A reel
contains 1000 devices.
(28-Pin SOIC)
Pin Descriptions
Pin # Pin Name
1
IOUT
DROOP
2
3
OCP
4
VHYST
5
VREFB
6
VSENSE
7
AGND
8
SOFTST
9
NC
10
LODRV
11
LOHIB
12
DRVGND
13
LOWDR
Pin Function
Current Out. The output voltage on this pin is proportional to the load current as measured
across the high side MOSFET, and is approximately equal to 2 x RDS(ON) Ix LOAD.
Droop Voltage. This pin is used to set the amount of output voltage set-point droop as a
function of load current. The voltage is set by a resistor divider between IOUT and AGND.
Over Current Protection. This pin is used to set the trip point for over current protection by a
resistor divider between IOUT and AGND.
Hysteresis Set Pin. This pin is used to set the amount of hysteresis required by a resistor
divider between VREFB and AGND.
Buffered Reference Voltage (from VID circuitry).
Output Voltage Sense.
Small Signal Analog and Digital Ground.
Soft Start. Connecting a capacitor from this pin to AGND sets the time delay.
Not connected.
Low Drive Control. Connecting this pin to +5V enables normal operation. When LOHIB is
grounded, this pin can be used to control LOWDR.
Low Side Inhibit. This pin is used to eliminate shoot-thru current.
Power Ground. Insure output capacitor ground is connected to this pin.
Low Side Driver Output. Connect to gate of low side MOSFET.
2002 Semtech Corp.
8
www.semtech.com
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