SG6860 Ver la hoja de datos (PDF) - Fairchild Semiconductor
Número de pieza
componentes Descripción
Lista de partido
SG6860 Datasheet PDF : 11 Pages
| |||
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Min.
Max.
Unit
VVDD
DC Supply Voltage
30
V
VFB
Input Voltage to FB Pin
-0.3
7.0
V
VSENSE Input Voltage to Sense Pin
-0.3
7.0
V
PD
Power Dissipation
300
mW
TJ
Operating Junction Temperature
+150
°C
θJA
Thermal Resistance (Junction-to-Air)
SOT
DIP
208.4
82.5
°C/W
°C/W
TSTG
Storage Temperature Range
-55
+150
°C
TL
ESD
Lead Temperature (Wave Soldering or IR, 10 seconds)
Electrostatic Discharge Capability, Human Body Model
Electrostatic Discharge Capability, Machine Model
+260
°C
3.5
KV
200
V
Notes:
1. All voltage values, except differential voltage, are given with respect to GND pin.
2. Stresses beyond those listed under “absolute maximum ratings“ may cause permanent damage to the device.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
Parameter
TA
Operating Ambient Temperature
Min.
-40
Typ.
Max.
+85
Unit
°C
© 2008 Fairchild Semiconductor Corporation
SG6860 • Rev. 1.0.1
4
www.fairchildsemi.com
Share Link: 