L88MS00T Series
Pd max – S
Common for L88MS00T series
Copper-clad area, S – mm2
* Pd is the value for when the solder on the surface of the IC heat sink has melted completely and the surface mount is
horizontal.
* Please be advised that the flow solder application system (full-heat method) cannot be recommended.
Lead Formings
MA forming
LR forming
VO – VIN
FA forming
VO – VIN
Input voltage, VIN – V
Input voltage, VIN – V
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