PCF50732H/F1 Ver la hoja de datos (PDF) - Philips Electronics

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PCF50732H/F1

Baseband and audio interface for GSM

Philips Electronics 

Philips Semiconductors

Baseband and audio interface for GSM

Objective specification

PCF50732

CONTENTS

14

1

FEATURES

15

2

APPLICATIONS

16

3

GENERAL DESCRIPTION

17

4

ORDERING INFORMATION

18

5

QUICK REFERENCE DATA

18.1

18.2

6

BLOCK DIAGRAM

18.3

7

PINNING

18.4

8

FUNCTIONAL DESCRIPTION

18.5

18.6

8.1

General

8.2

Baseband and voice band reference voltages

9

BASEBAND CODEC

18.7

9.1

Baseband transmit path

18.8

9.2

Baseband receive path

19

9.3

Baseband Serial Interface (BSI)

19.1

10

VOICE BAND CODEC

19.2

10.1

Voice band receive path

20

10.2

Voice band transmit path

21

10.3

Voice band digital circuitry

21.1

11

AUXILIARY FUNCTIONS

11.1

Automatic Gain Control (AGC): AUXDAC1

21.2

11.2

Automatic Frequency Control (AFC):

21.3

AUXDAC2

21.4

11.3

Power ramping: AUXDAC3

21.5

11.4

Auxiliary analog-to-digital converter (AUXADC)

12

CONTROL SERIAL INTERFACE (CSI)

22

12.1

The serial interface

23

12.2

Control Serial Interface (CSI) timing

characteristics

12.3

Control register block

13

VOICE BAND SIGNAL PROCESSOR (VSP)

13.1

Hardware description

13.2

VSP assembler language

13.3

Descriptions of the VSP instruction set

13.4

The assembler/emulator

LIMITING VALUES

THERMAL CHARACTERISTICS

DC CHARACTERISTICS

AC CHARACTERISTICS

FUNCTIONAL CHARACTERISTICS

Baseband transmit (BSI to TXI/Q)

Baseband receive (RXI/Q to BSI)

Voice band transmit (microphone to ASI)

Voice band receive (ASI to earphone)

Auxiliary digital-to-analog converters

Auxiliary analog-to-digital converters:

AUXADC1, AUXADC2, AUXADC3 and

AUXADC4

Typical total current consumption

Typical output loads

APPLICATION INFORMATION

Wake-up procedure from Sleep mode

Microphone input connection and test set-up

PACKAGE OUTLINES

SOLDERING

Introduction to soldering surface mount

packages

Reflow soldering

Wave soldering

Manual soldering

Suitability of surface mount IC packages for

wave and reflow soldering methods

DEFINITIONS

LIFE SUPPORT APPLICATIONS

1999 May 03

2

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