+
VC1 –
5
C1
4
RF1
50 Ω
TL1 C2
VDD
+
–
6
C3
3
DUT
RFC
50 Ω
7
2
C4 TL2
VC2
+
–
8
C5
1
RF2
50 Ω
TL3 C6
C1, C5 — 2.7 pF, Chip Capacitor
C2, C4, C6 — 100 pF, Chip Capacitor
C3 — 10 pF, Chip Capacitor
TL1, TL3 — 12 degrees of 50 Ω line at 1 GHz
TL2 — 15 degrees of 50 Ω line at 1 GHz
Note: Decoupling capacitors on pins 5, 6 and 8 must be as close as possible to the pins.
Figure 1. 300 MHz to 1600 MHz Test Circuit Configuration
+
VC1 –
5
C1
4
RF1
50 Ω
TL1 C2
VDD
+
–
6
C3
3
DUT
RFC
50 Ω
7
2
C4 TL2
VC2
+
–
8
C5
1
RF2
50 Ω
TL3 C6
C1, C5 — 1.3 pF, Chip Capacitor
C2, C3, C4, C6 — 8.2 pF, Chip Capacitor
TL1, TL3 — 12 degrees of 50 Ω line at 1 GHz
TL2 — 15 degrees of 50 Ω line at 1 GHz
Note: Decoupling capacitors on pins 5, 6 and 8 must be as close as possible to the pins.
Figure 2. 1600 MHz to 2000 MHz Test Circuit Configuration
MOTOROLA RF DEVICE DATA
MRFIC0903
3