SX1242 Ver la hoja de datos (PDF) - Semtech Corporation
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SX1242 Datasheet PDF : 14 Pages
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ADVANCED COMMUNICATIONS & SENSING
SX1242
Integrated Transmitter IC
DATASHEET
5. Packaging Information
The SX1242 is delivered in an SOIC package with 8 leads and an exposed pad. See details below.
5.1. Package Outline Drawing
5.2. Land Pattern
A
N
2X E/2
e
D
E1 E
12
ccc C
2X N/2 TIPS
e/2
B
aaa C
SEATING
PLANE
C
D
A2 A
A1
bxN
bbb C A-B D
F
DIMENSIONS
DIM
INCHES
MIN NOM MAX
MILLIMETERS
MIN NOM MAX
A .053 - .069 1.35 - 1.75
A1 .000 - .005 0.00 - 0.13
A2 .049 - .065 1.25 - 1.65
b .012 - .020 0.31 - 0.51
c .007 - .010 0.17 - 0.25
D .189 .193 .197 4.80 4.90 5.00
E1 .150 .154 .157 3.80 3.90 4.00
E
.236 BSC
6.00 BSC
e
.050 BSC
1.27 BSC
F .086 - .130 2.19 - 3.30
H .085 - .099 2.15 - 2.51
h .010 - .020 0.25 - 0.50
L .016 .028 .041 0.40 0.72 1.04
L1
(.041)
(1.05)
N
8
8
01 0° - 8° 0° - 8°
aaa
.004
0.10
bbb
.010
0.25
ccc
.008
0.20
h
EXPOSED PAD
H
H
GAGE
PLANE
h
c
0.25
L
(L1)
01
SIDE VIEW
DETAIL A
SEE DETAIL A
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H-
3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
Figure 7. Package Outline Drawing
E
D
(C) F
THERMAL VIA
P
Ø 0.36mm
SOLDER MASK
Z
G
Y
X
DIM
C
D
E
F
G
P
X
Y
Z
DIMENSIONS
INCHES MILLIMETERS
(.205)
(5.20)
.134
3.40
.201
5.10
.101
2.56
.118
3.00
.050
1.27
.024
0.60
.087
2.20
.291
7.40
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
3. REFERENCE IPC-SM-782A, RLP NO. 300A.
4. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD
SHALL BE CONNECTED TO A SYSTEM GROUND PLANE.
FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR
FUNCTIONAL PERFORMANCE OF THE DEVICE.
Figure 8. Land Pattern
SX1242, Rev 1, November 2010
©2010 Semtech Corp.
Page 11
www.semtech.com
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