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TDA18260HN/C1(2010) Ver la hoja de datos (PDF) - NXP Semiconductors.

Número de pieza
componentes Descripción
Lista de partido
TDA18260HN/C1
(Rev.:2010)
NXP
NXP Semiconductors. NXP
TDA18260HN/C1 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
NXP Semiconductors
TDA18260HN
Dual cable Silicon Tuner
RF Loop-Through (LT)
Fully integrated IF selectivity, eliminates external SAW filters
Fully integrated oscillators:
No external oscillator components for reduced cost
16 MHz crystal oscillator output buffer for single crystal applications
I2C-bus provides:
3.3 V microcontroller compatibility
Received Signal Strength Indicator (RSSI) data access
Die temperature sensor data access
Lead-free (Pb) manufacturing
3. Quick reference data
Table 1. Quick reference data
Symbol Parameter
Conditions
fRF
NFtun
n
RF frequency
tuner noise figure
phase noise
edge
maximum gain
RF frequency range, worst case
10 kHz
100 kHz
VL(tun-RF)
leakage voltage between
tuner and RF
at RF input; in RF TV band
CSO
composite second-order
distortion
CTB
composite triple beat
P
power dissipation
image
image rejection
measured at IF frequency = 4 MHz
RSSIacc(abs) absolute accuracy of received only one channel at RF input; channel
signal strength indicator
level from 15 dBmV to +15 dBmV;
calibration done at 0 dBmV
RSSIacc(rel) relative accuracy of received only one channel at RF input; channel
signal strength indicator
level from 15 dBmV to +15 dBmV
[1] Channel loading assumptions: 135 channels (NTSC 135 frequency plan) at 75 dBV.
4. Ordering information
Min Typ Max Unit
51 -
1002 MHz
-
6.0 <tbd> dB
-
85 -
dBc/Hz
-
107 -
dBc/Hz
-
10 +8 dBV
[1] -
64 <tbd> dBc
[1] -
60
-
1.6
<tbd> 62
3 -
<tbd> dBc
-
W
-
dB
+3 dB
0.5 -
+0.5 dB
Table 2. Ordering information
Type number Package
Name Description
TDA18260HN/C1 HVQFN48 plastic thermal enhanced very thin quad flat package;
no leads; 48 terminals; body 7 7 0.85 mm
Version
SOT619-1
TDA18260HN_SDS
Preliminary data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 14 December 2010
© NXP B.V. 2010. All rights reserved.
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