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TEA1208T

High efficiency DC/DC converter

Philips Electronics 

Philips Semiconductors

High efficiency DC/DC converter

Product specification

TEA1208T

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE(1)

BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA

HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN,

HVSON, SMS

PLCC(4), SO, SOJ

LQFP, QFP, TQFP

SSOP, TSSOP, VSO

SOLDERING METHOD

WAVE

REFLOW(2)

not suitable

not suitable(3)

suitable

suitable

suitable

not recommended(4)(5)

not recommended(6)

suitable

suitable

suitable

Notes

1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy

from your Philips Semiconductors sales office.

2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.

3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder

cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,

the solder might be deposited on the heatsink surface.

4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not

suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

2002 Nov 15

15

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