Chip Assembly Diagram
Vg
TGA4506
RF In
RF Out
Vd
All three Vd pads (pad # 9, 10, 11 from mechanical drawing)
do not need to be connected
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
9
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May 2009 © Rev -