TGA4521
Recommended Chip Assembly Diagram
Vg
1.0μF
0.01μF
100pF
100pF
0.01μF
Vd
1.0μF
TFN
RC
B
TFN
Vg
1.0μF
100pF (Alternative Vg)
0.01μF
Bias Conditions: Vd = 6 V
Vg = ~ -0.7 V to get 175mA Id
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
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TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
June 2008 © Rev