TGA4522 Ver la hoja de datos (PDF) - TriQuint Semiconductor
Número de pieza
componentes Descripción
Lista de partido
TGA4522 Datasheet PDF : 12 Pages
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TGA4522
1.450
(0.057)
1.351
(0.053)
Mechanical Drawing
0.108 0.261 0.391
(0.004) (0.010) (0.015)
0.530
(0.021)
1.352
(0.053)
1.500
(0.059)
1.670
(0.066)
23 4
56 7
8
1.351
(0.053)
1.071
(0.042)
0.398
(0.016)
0.129
(0.005)
0.099
(0.004)
0
1
13 12
11 10
9
RC
B
RC
B
0
0.391
0.530
(0.015) (0.021)
1.352
1.500
1.670
(0.053) (0.059) (0.066)
1.893 2.000
(0.075) (0.079)
Units: millimeters (inches)
Thickness: 0.100 (0.004)
Chip edge to bond pad dimensions are shown to center of bond pad
Chip size tolerance: +/- 0.051 (0.002)
GND is back side of MMIC
Bond pad #1
Bond pad #2
Bond pad #3, 13
Bond pad #4, 5, 7, 9, 11, 12
Bond pad #6, 10
Bond pad #8
(RF In)
(N/C)
(Vg)
(Vd)
(N/C)
(RF Out)
0.100 x 0.150
0.100 x 0.108
0.108 x 0.108
0.108 x 0.108
0.091 x 0.084
0.100 x 0.150
(0.004 x 0.006)
(0.004 x 0.004)
(0.004 x 0.004)
(0.004 x 0.004)
(0.004 x 0.003)
(0.004 x 0.006)
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
10
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May 2009 © Rev -
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