TGA4541-SM
Ka-Band Variable Gain Driver Amplifier
Mechanical Information
Package Information and Dimensions
All dimensions are in millimeters.
This package is lead-free/RoHS-compliant with a copper alloy base (CDA194), and the plating material on the leads is
NiPdAu. It is compatible with both lead-free (maximum 260 °C reflow temperature) and tin-lead (maximum 245 °C reflow
temperature) soldering processes.
Preliminary Data Sheet: Rev- 05/08/12
© 2012 TriQuint Semiconductor, Inc.
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Disclaimer: Subject to change without notice
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