XEV90C-ITR Ver la hoja de datos (PDF) - Xecom

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XEV90C-ITR

PLCC Packaged DAA for Europe and North America

Xecom 

Slim-Link® PLCC Soldering Instructions

Because of its Hybrid construction, the XEV90C DAA is subject to damage if over-exposed to heat during solder

reflow operations. Following the soldering instructions below will ensure that the process of soldering the module to

the board does not damage the DAA.

Maximum Temperature

Maximum Time at 220O C

Maximum Time above Eutectic (180O C)

Maximum Preheat Dwell Time

220O C

20 Seconds

90 Seconds

180 Seconds

Maximum Recommended Solder Temperature Profile

220O C

180O C

150O C

--------------------------------180 sec max ---------------------

-20 sec-

max

----- 90 sec max -----

Notes:

Because of their large black bodies, Xecom’s XEV90C DAA modules must not be exposed to direct Infrared (IR)

heating. If your process includes direct IR heating, you must shield the PLCC DAA module from the infrared rays.

Xecom’s XEV90C DAA modules should be exposed to no more than one reflow cycle.

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XEV90C

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