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XE014JS-ITR

PLCC DAA for Shared-Line Applications

Xecom 

XE014JS Soldering Instructions

Because of its Hybrid construction, the XE014JS PLCC DAA’s are subject to damage if over-exposed to heat during

solder reflow operations. Following the soldering instructions below will ensure that the process of soldering the

module to the board does not damage the DAA.

Maximum Temperature 220O C

Maximum Time at 220O C 20 Seconds

Maximum Time above Eutectic (180O C) 90 Seconds

Maximum Preheat Dwell Time 180 Seconds

Maximum Recommended Solder Profile

220O C

180O C

150O C

180 sec

max

-20 sec-

max

----- 90 sec max -----

Notes:

Because of their large black bodies, Xecom’s XE014JS DAA modules must not be exposed to direct Infrared Ray

(IR) heating. If your process includes direct IR heating, you must shield the PLCC DAA module from the infrared

rays.

Xecom’s PLCC DAA modules should be exposed to no more than one reflow cycle.

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XE014JS

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