UPC8002GR Ver la hoja de datos (PDF) - NEC => Renesas Technology

Número de pieza

componentes Descripción

Lista de partido

UPC8002GR

SECOND MIXER + IF AMPLIFIER FOR DIGITAL CORDLESS TELEPHONES

NEC => Renesas Technology 

µPC8002

11. RECOMMENDED SOLDERING CONDITIONS

The following conditions ( see table below) must be met when soldering this product.

For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY

MANUAL" (C10535E).

Please consult with our sales offices in case other soldering process or condition is used.

TYPE OF SURFACE MOUNT DEVICE

µPC8002GR

Soldering process

Infrared Ray Reflow

Soldering conditions

Symbol

Peak package's surface temperature: 235 ˚C or below.

IR35-107-2

Reflow time : 30 seconds or below (210 ˚C or higher),

Number of reflow processes : MAX.2

Exposure limit Note : 7 days

(10 hours pre-baking is required at 125 ˚C afterwards)

VPS

Peak package's temperature: 215 ˚C or below.

VP15-107-2

Reflow time : 40 seconds or below (200 ˚C or higher),

Number of reflow processes : MAX. 2

Exposure limit Note : 7 days

(10 hours pre-baking is required at 125 ˚C afterwards)

Partial heating

method

Terminal temperature : 300 ˚C or below,

Time : 3 seconds or below (Per side of pin position)

Note Exposure limit before soldering after dry-pack package is opened.

Storage conditions : 25 ˚C and relative humidity at 65 % or less.

Caution Do not apply more than one soldering method at any one time, except for " Partial heating

method".

30

Share Link: