UPC8158K-E1 Ver la hoja de datos (PDF) - NEC => Renesas Technology

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UPC8158K-E1

RF UP-CONVERTER WITH AGC FUNCTION + IF QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATION SYSTEMS

NEC => Renesas Technology 

µPC8158K

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered under the following recommended conditions. For soldering methods and

conditions other than those recommended below, contact your NEC sales representative.

µPC8158K

Soldering Method

Soldering Conditions

Infrared Reflow

Partial Heating

Package peak temperature: 235°C or below

Time: 30 seconds or less (at 210°C)

Count: 2, Exposure limitNote: None

Pin temperature: 300°C

Time: 3 seconds or less (per side of device)

Exposure limitNote: None

Recommended Condition

Symbol

IR35-00-2

–

Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).

For details of recommended soldering conditions for surface mounting, refer to information document

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

Preliminary Data Sheet P13831EJ1V1DS00

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