USB2507-ADT(2006) Ver la hoja de datos (PDF) - SMSC -> Microchip
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USB2507-ADT Datasheet PDF : 44 Pages
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Chapter 9 Package Outline
Integrated USB 2.0 Compatible 7-Port Hub
Datasheet
Figure 9.1 80 Pin TQFP Package Outline (12x12x1.4 mm body - 2 mm footprint)
Table 9.1 80 Pin TQFP Package Parameters
MIN
NOMINAL
MAX
A
1.40
~
1.60
A1
0.05
~
0.15
A2
1.35
1.40
1.45
D
13.80
14.00
14.20
D1
11.80
12.00
12.20
E
13.80
14.00
14.20
E1
11.80
12.00
12.20
H
0.09
~
0.20
L
0.45
0.60
0.75
L1
~
1.00 REF.
~
e
0.50 Basic
q
0o
~
7o
W
0.17
0.18
0.27
ccc
~
~
0.08
REMARKS
Overall Package Height
Standoff
Body Thickness
X Span
X body Size
Y Span
Y body Size
Lead Frame Thickness
Lead Foot Length
Lead Length
Lead Pitch
Lead Foot Angle
Lead Width
Coplanarity
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ± 0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm per side. D1 and E1 dimensions determined at datum plane
H.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
Revision 2.1 (12-06-06)
44
DATASHEET
SMSC USB2507
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