V36RA22 Ver la hoja de datos (PDF) - Littelfuse, Inc
Número de pieza
componentes Descripción
Lista de partido
V36RA22 Datasheet PDF : 8 Pages
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Varistor Products
Low Profile / Application Specific Varistors > RA Series
Wave Solder Profile
Reflow Condition
Pb – Free assembly
- Temperature Min (Ts(min))
Pre Heat - Temperature Max (Ts(max))
- Time (min to max) (ts)
Average ramp–up rate (Liquidus Temp (TL)
to peak
TS(max) to TL - Ramp-up Rate
Reflow
- Temperature (TL) (Liquidus)
- Temperature (tL)
Peak Temperature (TP)
Time within 5°C of actual peak
Temperature (tp)
Ramp-down Rate
Time 25°C to peak Temperature (TP)
Do not exceed
150°C
200°C
60 – 180 secs
5°C/second max
5°C/second max
217°C
60 – 150 seconds
250+0/-5°C
20 – 40 seconds
5°C/second max
8 minutes Max.
260°C
Lead–free Profile
300
Maximum Wave 260C
250
200
150
100
50
0
0
0.5
1
1.5
2
2.5
3
3.5
4
Figure 16
TIME(MINUTES)
Non Lead–free Profile
300
Maximum Wave 240C
250
200
150
100
50
0
0
0.5
1
1.5
2
2.5
3
3.5
4
Figure 17
TIME(MINUTES)
Environmental Specifications
Operating/Storage
Temperature
Humidity Aging
Thermal Shock
-55°C to +125°C / -55°C to +150°C
+85°C, 85% RH, 1000 hours
+/-10% Voltage
+85°C to -40°C 10 times
+/-10% Voltage
Solvent Resistance MIL–STD–202, Method 215F
Moisture Sensitivity Level 1, J–STD–020C
Physical Specifications
Lead Material
Tin–Coated Copper
Soldering
Characteristics
Solderability per MIL–STD–202,
Method 208E
Insulating Material
Cured, flame retardant epoxy polymer
meets UL94V–0 requirements.
Device Labeling
Marked with LF, voltage, amperage rating,
and date code.
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/ra.html for current information.
199
Revision: November 11, 2009
RA Varistor Series
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