25Q16DWFIG(2011) Ver la hoja de datos (PDF) - Winbond
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25Q16DWFIG Datasheet PDF : 83 Pages
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W25Q16DW
6. PIN CONFIGURATION SOIC 300-MIL
/HOLD (IO3)
1
VCC
2
N/C
3
N/C
4
N/C
5
N/C
6
/CS
7
DO (IO1)
8
16
CLK
15
DI (IO0)
14
N/C
13
N/C
12
N/C
11
N/C
10
GND
9
/WP (IO2)
Figure 1c. W25Q16DW Pin Assignments, 16-pin SOIC 300-mil (Package Code SF)
7. PIN DESCRIPTION SOIC 300-MIL
PAD NO.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
PAD NAME
/HOLD (IO3)
VCC
N/C
N/C
N/C
N/C
/CS
DO (IO1)
/WP (IO2)
GND
N/C
N/C
N/C
N/C
DI (IO0)
CLK
I/O
FUNCTION
I/O
Hold Input (Data Input Output 3)*2
Power Supply
No Connect
No Connect
No Connect
No Connect
I
Chip Select Input
I/O
Data Output (Data Input Output 1)*1
I/O
Write Protect Input (Data Input Output 2)*2
Ground
No Connect
No Connect
No Connect
No Connect
I/O
Data Input (Data Input Output 0)*1
I
Serial Clock Input
*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 – IO3 are used for Quad SPI/QPI instructions
7.1 Package Types
Publication Release Date: April 01, 2011
-7-
Preliminary - Revision A
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