MSM5260GS-L Ver la hoja de datos (PDF) - Oki Electric Industry
Número de pieza
componentes Descripción
Lista de partido
MSM5260GS-L Datasheet PDF : 12 Pages
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¡ Semiconductor
QFP100-P-1420-0.65-L
Spherical surface
MSM5260
(Unit : mm)
Notes for Mounting the Surface Mount Type Package
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.29 TYP.
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
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