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MA4P1000

High Power PIN Diodes

Unspecified 

MA4P MELF & HIPAX Series

High Power PIN Diodes

V16

MELF Assembly Recommendations

Devices may be soldered using standard 60Sn/40Pb or RoHS compliant solders. Axial leads and solderable

surfaces of MELF devices are tin plated 50 μm thick to ensure an optimum connection.

For recommended Sn/Pb and RoHS soldering profiles See Application Note M538 on the MACOM website.

Circuit Pad Layout for MELF Diodes

Dimension

A

B

C

Package Style

1072

1091

inches mm inches

mm

0.093 2.36 0.150

3.81

0.050 1.27 0.050

1.27

0.060 1.52 0.100

2.54

MELF Internal Construction

A

C

B

B

Ordering Information

MELF diodes are available in tape and reel in quantities as shown in table below

Package Style

1072T

1091T

Quantity (7” Reel)

1500 or 5000

500

Tape and reel information can be found in application note M513 the MACOM website.

Bulk Devices Per Bag

N/A

N/A

11

MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

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