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MIC5201

200 mA Low Dropout Regulator

Microchip Technology 

MIC5201

For MIC5201-x.xYS (SOT-223 package) heat sink

characteristics, please refer to Application Hint 17, P.C.

Board Heat Sinking.

245 mm

50 mm

150 mm

30 mm

50 mm

FIGURE 4-4:

Minimum Recommended

SOIC-8 PCB Pads Size.

DS20005718A-page 14

 2017 Microchip Technology Inc.

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