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MIC5201

200 mA Low Dropout Regulator

Microchip Technology 

MIC5201

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Sym. Min. Typ.

Max. Units

Conditions

Temperature Ranges

Storage Temperature Range

Lead Temperature

TJ

–40

—

+125

°C —

—

—

—

+260

°C Soldering, 5 sec.

Package Thermal Resistance

Thermal Resistance SOT-223

θJC

—

15

θJA

—

62

—

See Thermal

—

°C/W Considerations Layout

for more information.

Thermal Resistance 8-Ld SOIC

θJA

—

160

See Thermal

—

°C/W Considerations Layout

for more information.

Note 1:

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

DS20005718A-page 6

 2017 Microchip Technology Inc.

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