EHP-A07/UB01-P01 Ver la hoja de datos (PDF) - Unspecified

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EHP-A07/UB01-P01

High Power LED – 1W

Unspecified 

EVERLIGHT ELECTRONICS CO.,LTD.

Precautions For Use

EHP-A07/UB01-P01

1. Over-current-proof

Though EHP-A07 has conducted ESD protection mechanism, customer must not use the device in

reverse and should apply resistors for extra protection. Otherwise slight voltage shift may cause

enormous current change and burn out failure would happen.

2. Storage

i. Do not open moisture proof bag before the products are ready to use.

ii. Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less.

iii. The LEDs should be used within a year.

iv. After opening the package, the LEDs should be kept at 30℃ or less and 70%RH or less.

v. The LEDs should be used within 168 hours (7 days) after opening the package.

vi. If the moisture absorbent material (silicone gel) has faded away or the LEDs have exceeded the

storage time, baking treatment should be performed using the following conditions.

vii. Pre-curing treatment : 60±5℃ for 24 hours.

3. Thermal Management

i. Because EHP-A07 LED is a high power dissipation device, special and sufficient consideration in

thermal management design must be made to optimize the thermal performance.

ii. Heat sink design is implemented in the device for an additional thermal connection. Since the device

is capable of SMT process, tin must be spread both heat sink and solder pads areas to dissipate the

heat.

iii. A high thermal conductivity substrate, such as Aluminum or Copper plate etc, must be applied for

external thermal management. It is strongly recommended that the outer heat sink or PCB

dimension per LED can not be less than 25 x 25 x 1 (L x W x H) mm. The materials for outer heat

sink can be FR4 on Aluminum, MCPCB, or FPC on Aluminum.

iv. Sspecial thermal designs are also recommended to take in outer heat sink design, such as FR4 PCB

on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc.

v. Sufficient thermal management must be conducted, or the die junction temperature will be over the

limit under large electronic driving and LED lifetime will decrease critically.

Everlight Electronics Co., Ltd.

Device No. : DSE-7N1-003

http://www.everlight.com

Prepared date: Sep 10, 2006

Rev. 2.0

Page: 9 of 11

Prepared by: Peggy Chen

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