SP1001(2011) Ver la hoja de datos (PDF) - Littelfuse, Inc
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SP1001 Datasheet PDF : 6 Pages
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TVS Diode Arrays (SPA™Family of Products)
General Purpose ESD Protection - SP1001 Series
Absolute Maximum Ratings
Symbol
IPP
T
OP
T
STOR
Parameter
Peak Current (tp=8/20μs)
Operating Temperature
Storage Temperature
Value
2
-40 to 85
-60 to 150
Units
A
°C
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Thermal Information
Parameter
Storage Temperature Range
Maximum Junction Temperature
Maximum Lead Temperature (Soldering 10s)
Rating Units
-65 to 150 °C
150
°C
260
°C
Electrical Characteristics (TOP = 25°C)
Parameter
Forward Voltage Drop
Reverse Voltage Drop
Reverse Standoff Voltage
Reverse Leakage Current
Clamp Voltage1
Dynamic Resistance
ESD Withstand Voltage1,2
Diode Capacitance1
Symbol
Test Conditions
Min
Typ
Max
Units
VF
IF=10mA
0.7
0.9
1.2
V
VR
IR=1mA
7.0
7.8
8.5
V
V
RWM
I ≤1μA
R
5.5
V
I
LEAK
V =5V
R
0.5
μA
V
C
RDYN
I =1A, t =8/20μs, Fwd
PP
p
I =2A, t =8/20μs, Fwd
PP
p
(VC2 - VC1) / (IPP2 - IPP1)
8.0
11.0
V
9.7
13.0
V
1.7
Ω
IEC61000-4-2 (Contact)
±15
kV
VESD
IEC61000-4-2 (Air)
±30
kV
Reverse Bias=0V
12
pF
CD
Reverse Bias=2.5V
8
pF
Reverse Bias=5V
7
pF
Notes:
1 Parameter is guaranteed by device characterization
2 A minimum of 1,000 ESD pulses are applied at 1s intervals between the anode and common cathode of each diode
Capacitance vs. Reverse Bias
14
12
10
8
6
4
2
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
DC Bias (V)
Design Consideration
Because of the fast rise-time of the ESD transient,
placement of ESD devices is a key design consideration.
To achieve optimal ESD suppression, the devices should be
placed on the circuit board as close to the source of the ESD
transient as possible. Install the ESD suppressors directly
behind the connector so that they are the first board-level
circuit component encountered by the ESD transient. They
are connected from signal/data line to ground.
SP1001 Series
22
Revision: April 14, 2011
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
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