ADT7310 Ver la hoja de datos (PDF) - Analog Devices
Número de pieza
componentes Descripción
Lista de partido
ADT7310 Datasheet PDF : 25 Pages
| |||
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
VDD to GND
DIN Input Voltage to GND
DOUT Voltage to GND
SCLK Input Voltage to GND
CS Input Voltage to GND
CT and INT Output Voltage to GND
ESD Rating (Human Body Model)
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature, TJMAX
8-Lead SOIC-N (R-8)
Power Dissipation1
Thermal Impedance3
θJA, Junction-to-Ambient (Still Air)
θJC, Junction-to-Case
IR Reflow Soldering
Peak Temperature (RoHS-
Compliant Package)
Time at Peak Temperature
Ramp-Up Rate
Ramp-Down Rate
Time from 25°C to Peak Temperature
Rating
–0.3 V to +7 V
–0.3 V to VDD + 0.3 V
–0.3 V to VDD + 0.3 V
–0.3 V to VDD + 0.3 V
–0.3 V to VDD + 0.3 V
–0.3 V to VDD + 0.3 V
2.0 kV
–55°C to +150°C
–65°C to +160°C
150°C
WMAX = (TJMAX − TA2)/θJA
121°C/W
56°C/W
220°C
260°C (0°C)
20 sec to 40 sec
3°C/sec maximum
–6°C/sec maximum
8 minutes maximum
1 Values relate to package being used on a standard 2-layer PCB. This gives a
worst-case θJA and θJC. See Figure 4 for a plot of maximum power dissipation
vs. ambient temperature (TA).
2 TA = ambient temperature.
3 Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a heat
sink. Junction-to-ambient is more useful for air-cooled, PCB-mounted
components.
ADT7310
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
1.2
1.0
0.8
0.6
0.4
0.2
MAX PD = 3.4mW AT 150°C
0
TEMPERATURE (°C)
Figure 4. SOIC_N Maximum Power Dissipation vs. Temperature
ESD CAUTION
Rev. A | Page 5 of 24
Share Link: 