CS5126 Ver la hoja de datos (PDF) - ON Semiconductor
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CS5126 Datasheet PDF : 12 Pages
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CS5124, CS5126
–X–
A
PACKAGE DIMENSIONS
SO–8
D SUFFIX
CASE 751–07
ISSUE V
8
5
B
S
0.25 (0.010) M Y M
1
4
–Y–
K
G
–Z–
C
SEATING
PLANE
N X 45 _
H
D
0.10 (0.004)
M
J
0.25 (0.010) M Z Y S X S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
PACKAGE THERMAL DATA
Parameter
RΘJC
RΘJA
Typical
Typical
SO–8
45
165
Unit
°C/W
°C/W
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