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FMA219

X-BAND LNA MMIC

Filtronic PLC 

RECOMMENDED ASSEMBLY SCHEMATIC:

75µm nominal gap on

each side

FMA219

Datasheet v3.0

Input and output thin film

substrates with 50Ω microstrip

transmission lines. Substrate

thickness 250µm or thinner is

recommended.

25µm dia. Au wire (x2) on

input and output ports, less

than 1000µm length each

150pF

capacitor

Note: The supply de-coupling

capacitor (150 pF recommended

value) should be placed as close

to the MMIC as practical.

250µm Au ribbon

To +VDD recommended

PREFERRED ASSEMBLY INSTRUCTIONS:

GaAs devices are fragile and should be

handled with great care. Specially designed

collets should be used where possible.

The back of the die is metallised and the

recommended mounting method is by the use

of conductive epoxy following the

manufacturer’s

recommended

curing

temperature. For eutectic 80/20 gold/tin

solder, use a stage temperature of 280-300°C

for a maximum time of 60s. Use forming gas

(90%N2, 10% H2) for best results.

Recommended lead bond technique is

thermocompression wedge bonding with 25µm

diameter wire. The bond tool force shall be

35-38g. Bonding stage temperature shall be

230-240°C, heated tool (150-160°C) is

recommended. Ultrasonic bonding is not

recommended.

should be observed at all stages of storage,

handling, assembly, and testing. These

devices should be treated as Class 0 (0-250 V)

as defined in JEDEC Standard No. 22-A114.

Further information on ESD control measures

can be found in MIL-STD-1686 and MIL-

HDBK-263.

APPLICATION NOTES & DESIGN DATA:

Application Notes and design data including S-

parameters are available on request

DISCLAIMERS:

This product is not designed for use in any

space based or life sustaining/supporting

equipment.

ORDERING INFORMATION:

HANDLING

PRECAUTIONS:

To avoid damage to the devices care should

be exercised during handling. Proper

Electrostatic Discharge (ESD) precautions

5

PART NUMBER

FMA219

Tel: +44 (0) 1325 301111

Specifications subject to change without notice

Filtronic Compound Semiconductors Ltd

Fax: +44 (0) 1325 306177

Email: sales@filcs.com

DESCRIPTION

Die

Website: www.filtronic.com

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