HL02R05S05 Ver la hoja de datos (PDF) - C AND D TECHNOLOGIES
Número de pieza
componentes Descripción
Lista de partido
HL02R05S05 Datasheet PDF : 4 Pages
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MECHANICAL
Package/Pinout "Y" and "Z"
1.285±0.010"
(32.64±0.25)
2423 22
1514 13
0.525±0.010"
(13.34±0.25)
HL02RxxyzzY
1 23
10 11 12
0.375±0.005"
(9.52±0.13)
0.015±0.005"
(0.38±0.13)
0.100±0.010"
(2.54±0.25)
0.020±0.002"
(0.51±0.05)
0°-15°
0.600"
(15.24)
0.125+0.030"
-0.000"
(3.18+0.76)
( -0.00)
TOP VIEWS
1.285±0.010"
(32.64±0.25)
2423 22
1514 13
0.525±0.010"
(13.34±0.25)
HL02RxxyzzZ
0.695±0.015"
(17.65±0.38)
1 23
10 11 12
SIDE VIEWS
0.375±0.005"
(9.52±0.13)
0.015±0.005"
(0.38±0.13)
0.100±0.010"
(2.54±0.25)
0.020±0.002"
(0.51±0.05)
END VIEWS
0.014±0.002"
(0.36±0.05)
.015±.010"
(.38±.25)
DIP PACKAGE
NC = No Internal Connection.
NU = Do Not Use.
Duplicate pin functions are internally connected.
All dimensions are in inches (millimeters).
GRID: 0.100 inches (2.54 millimeters)
Typically Marked with: specific model ordered, date
code, job code and Logo.
SMD PACKAGE
PIN CONNECTIONS
PIN# SINGLES DUALS
1
+VIN
+VIN
2
NU
-VOUT
3
NU
Common
10
-VOUT Common
11
+VOUT
+VOUT
12
-VIN
-VIN
13
-VIN
-VIN
14
+VOUT
+VOUT
15
-VOUT Common
22
NU
Common
23
NU
-VOUT
24
+VIN
+VIN
RECOMMENDED LAND PATTERN
0.100"
(2.54)
2423 22
1514 13
0.730"
(18.54)
0.040"
(1.02)
0.080"
(2.03)
1 23
1.150"
(29.21)
10 11 12
HL02RrevD,10/97
RECOMMENDED REFLOW PROFILE
30 sec MAX
(>220°C)
250
235 °C MAX
220
200
190
150
100
90 sec MAX
(>190°C)
50
TIME (seconds)
Page 3
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