NE556 Ver la hoja de datos (PDF) - STMicroelectronics
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NE556 Datasheet PDF : 16 Pages
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NE556 - SA556 - SE556
Absolute maximum ratings and operating conditions
2
Absolute maximum ratings and operating conditions
Table 1. Absolute maximum ratings
Symbol
Parameter
Value
Unit
VCC
IOUT
Rthja
Rthjc
ESD
Supply voltage
Output current (sink and source)
Thermal resistance junction to ambient(1)
DIP14
SO-14
Thermal resistance junction to case (1)
DIP14
SO-14
Human body model (HBM)(2)
Machine model (MM)(3)
Charged device model (CDM)(4)
18
±225
80
105
33
31
1000
150
1500
V
mA
°C/W
°C/W
V
Latch-up immunity
200
mA
TLEAD
Lead temperature (soldering 10 seconds)
260
°C
Tj
Junction temperature
150
°C
Tstg
Storage temperature range
-65 to 150
°C
1. Short-circuits can cause excessive heating. These values are typical and valid only for a single layer PCB.
2. Human body model: a 100 pF capacitor is charged to the specified voltage, then discharged through a
1.5kΩ resistor between two pins of the device. This is done for all couples of connected pin combinations
while the other pins are floating.
3. Machine model: a 200 pF capacitor is charged to the specified voltage, then discharged directly between
two pins of the device with no external series resistor (internal resistor < 5 Ω). This is done for all couples of
connected pin combinations while the other pins are floating.
4. Charged device model: all pins and the package are charged together to the specified voltage and then
discharged directly to the ground through only one pin. This is done for all pins.
Table 2. Operating conditions
Symbol
Parameter
Value
Unit
VCC
Vth, Vtrig,
Vcl, Vreset
IOUT
Toper
Supply voltage
NE556
SA556
SE556
Maximum input voltage
Output current (sink and source)
Operating free air temperature range
NE556
SA556
SE556
4.5 to 16
V
4.5 to 16
4.5 to 18
VCC
V
±200
mA
0 to 70
°C
-40 to 105
-55 to 125
3/16
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