FEATURES
Planar Die Construction
Ultra-Small Surface Mount Package
General purpose, Medium Current
Ideally Suited for Automated Assembly
Processes
SOD-123 Plastic-Encapsulate
MMSZ5221B-MMSZ5260B
Zener Diode
MAXIMUM RATINGS TA= 25°C unless otherwise specified
01/14/2007 Rev. 1.00
www.SiliconStandard.com
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