SK33 Ver la hoja de datos (PDF) - Orister Corporation
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SK33 Datasheet PDF : 11 Pages
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MSOP‐10(EP) Dimension
Page No. : 8/11
NOTES:
A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash, protrusion.
D. This package is designed to be soldered to a thermal pad on the board.
E. Falls within JEDEC MO‐187 variation BA‐T.
DS‐RS6515‐08 JULY, 2010
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