UGB10 Ver la hoja de datos (PDF) - Vishay Semiconductors
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UGB10 Datasheet PDF : 3 Pages
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BYT28, BYT28F, BYT28B, UG10GCT, UGF10GCT, UGB10GCTSeries
Vishay Semiconductors
formerly General Semiconductor
Maximum Ratings (TC = 25°C unless otherwise noted)
Parameter
Symbol
Maximum repetitive peak reverse voltage
VRRM
Maximum working reverse voltage
VRWM
Maximum RMS voltage
VRMS
Maximum DC blocking voltage
VDC
Maximum average forward rectified
current at TC = 100°C
total device
per leg
IF(AV)
Peak forward surge current
8.3ms single half sine-wave superimposed
IFSM
on rated load (JEDEC Method) per leg
Operating junction and storage temperature range
TJ, TSTG
RMS Isolation voltage (BYT28F, UGF types)
from terminals to heatsink with t = 1 second, RH ≤ 30%
VISOL
Electrical Characteristics (TC = 25°C unless otherwise noted)
Parameter
Symbol
Maximum instantaneous forward voltage per leg(4)
at IF = 5A, TJ = 25°C
at IF = 10A, TJ = 25°C
VF
at IF = 5A, TJ = 150°C
Maximum reverse current per leg
at VRRM
TJ = 25°C
TJ = 100°C
IR
Maximum reverse recovery time per leg at
IF = 0.5A, IR = 1.0A, Irr = 0.25A
trr
Maximum reverse recovery time per leg at
IF = 1.0A, di/dt = 100A/µs, VR = 30V, Irr = 0.1 IRM
trr
Maximum reverse recovery current per leg at
IF = 5A, di/dt = 50A/µs, VR = 30V, TC = 100°C
IRM
Maximum stored charge per leg
IF = 2A, di/dt = 20A/µs, VR = 30V, Irr = 0.1 IRM
Qrr
UG10FCT
UG10GCT
BYT28-300
BYT28-400
300
400
300
400
210
280
300
400
10
5
60
–40 to +150
4500(1)
3500(2)
1500(3)
Value
1.30
1.40
1.05
10
200
35
50
3.0
50
Unit
V
V
V
A
A
°C
V
Unit
V
µA
ns
ns
A
nC
Thermal Characteristics (TC = 25°C unless otherwise noted)
Parameter
Symbol
Typical thermal resistance junction to case
RΘJC
Notes:
(1) Clip mounting (on case), where lead does not overlap heatsink with 0.110” offset
(2) Clip mounting (on case), where leads do overlap heatsink
(3) Screw mounting with 4-40 screw, where washer diameter is ≤ 4.9 mm (0.19”)
(4) Pulse test: 300µs pulse width, 1% duty cycle
UG10
BYT28
4.5
UGF10
BYT28F
6.7
UGB10
BYT28B
4.5
Unit
°C/W
www.vishay.com
2
Document Number 88552
15-Apr-02
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