WSF41632-22XX Ver la hoja de datos (PDF) - White Electronic Designs Corporation

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WSF41632-22XX

128KX32 SRAM & 512Kx32 FLASH MIXED MODULE

White Electronic Designs Corporation 

White Electronic Designs

WSF41632-22XX

PRELIMINARY

PACKAGE 402: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H2)

35.2 (1.385) ± 0.38 (0.015) SQ

PIN 1 IDENTIFIER

SQUARE PAD

ON BOTTOM

25.4 (1.0) TYP

5.7 (0.223)

MAX

3.81 (0.150)

± 0.1 (0.005)

2.54 (0.100)

TYP

15.24 (0.600) TYP

25.4 (1.0) TYP

1.27 (0.050) ± 0.1 (0.005)

0.76 (0.030) ± 0.1 (0.005)

1.27 (0.050) TYP DIA

0.46 (0.018) ± 0.05 (0.002) DIA

ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES

ORDERING INFORMATION

W S F 41632 - 22 X X X

LEAD FINISH:

Blank = Gold plated leads

A = Solder dip leads

DEVICE GRADE:

M = Military Screened

I = Industrial

C = Commercial

-55°C to +125°C

-40°C to +85°C

0°C to +70°C

PACKAGE TYPE:

H2 = Ceramic Hex In-line Package, HIP (Package 402)

G2T = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 509)

ACCESS TIME (ns)

22 = 25ns SRAM and 120ns FLASH

ORGANIZATION, 128K x 32

Flash PROM

SRAM

WHITE ELECTRONIC DESIGNS CORP.

White Electronic Designs Corp. reserves the right to change products or specifications without notice.

October, 2002

Rev. 4

14

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

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