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RMPA29200

29–31 GHZ 2 Watt Power Amplifier MMIC

Fairchild Semiconductor 

2 MIL GAP

5 MIL THICK

ALUMINA

50Ω

RF INPUT

DIE-ATTACH

80Au/20Sn

5 MIL THICK

ALUMINA

50Ω

RF OUTPUT

100pF

100pF

100pF

100pF

L < 0.015"

(4 Places)

0.01µF

0.01µF

0.01µF

0.01µF

Vg (NEGATIVE)

Vd (POSITIVE)

MMIC has Vg and Vd bias pads accessible on both top and bottom sides. DC bias connections are required only on one side.

Note:

Use 0.003" by 0.0005" gold ribbon or 1 mil gold wire for bonding. RF input and output bonds should be less than 0.015" long

with stress relief.

Figure 4. Recommended Assembly and Bonding Diagram

©2004 Fairchild Semiconductor Corporation

RMPA29200 Rev. D

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