HLMP-CB30 Ver la hoja de datos (PDF) - Unspecified
Número de pieza
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HLMP-CB30 Datasheet PDF : 11 Pages
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Recommended Wave Soldering Profile
TURBULENT WAVE
250
LAMINAR WAVE
HOT AIR KNIFE
200
150
FLUXING
100
50
30
PREHEAT
0
10
20
30
40
50
60
TIME - SECONDS
Ammo Packs Drawing
6.35±1.30
0.25±0.0512
12.70±1.00
0.50±0.0394
70
80
TOP SIDE
OF PC BOARD
BOTTOM SIDE
OF PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C ± 5˚C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
LEAD FREE SOLDER
96.5%Sn; 3.0%Ag; 0.5% Cu
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
90
100
CATHODE
9.125±0.625
0.3593±0.0246
20.50±1.00
0.807±0.039
18.00±0.50
0.7087±0.0197
12.70±0.30
0.50±0.0118
A
A
0.70±0.20
0.0276±0.0079
VIEW A-A
∅4.00±0.20TYP.
0.1575±0.008
Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff
10
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