ISL8200MM Ver la hoja de datos (PDF) - Intersil
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Lista de partido
ISL8200MM Datasheet PDF : 24 Pages
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ISL8200MM
Pin Descriptions (Continued)
PIN
NUMBER
PIN
NAME
PIN DESCRIPTION
23
NC
Not internally connected.
PD1 Phase Thermal Pad Used for both the PHASE pin (Pin # 16) and for heat removal connecting to heat dissipation layers using Vias. Connect this
pad to a copper island on the PCB board with the same shape as the PHASE thermal pad. Potential should be floating and
not electrically connected to anything except PHASE pin.
PD2 VIN Thermal Pad Used for both the PVIN pin (Pin # 17) and for heat removal connecting to heat dissipation layers using Vias. Connect this
pad to a copper island on the PCB board with the same shape as the VIN thermal pad. Potential should be floating and
not electrically connected to anything except VPVIN pin.
PD3 PGND Thermal Pad Used for both the PGND pin (Pin # 18) and for heat removal connecting to heat dissipation layers using Vias. Connect this
pad to a copper island on the PCB board with the same shape as the PGND thermal pad. Potential should be floating and
not electrically connected to anything except PGND pin.
PD4 VOUT Thermal Pad Used for both the VOUT pin (Pin # 19) and for heat removal connecting to heat dissipation layers using Vias. Connect this
pad to a copper island on the PCB board with the same shape as the VOUT thermal pad. Potential should be floating and
not electrically connected to anything except VOUT pin.
Typical Application Circuits
VIN
GND
ISISUILSL2L88082212000000MMMMMRREPEP
R1
16. 5k
C IN (CE R)
PVIN
VIN
FF
R2
C EN
4. 12k
1nF
EN
* Select R1 & R2
such that
0.8V<VEN<5.0V
IS F ETD RV 1
F SY NC_IN
C LKOU T
I SH AR E_BU S
I SF E TD R V
VOU T
VOU T
GND
2. 2k
R SE T
C OU T
VOU T_S ET
VSE N_R EM-
PGOOD1
PGOOD
PH _C NTR L
VC C
(See Table 1,
VOUT - RSET on page 13)
R ISH AR E
5k
C PVC C
10uF
FIGURE 3. SINGLE PHASE 10A 1.2V OUTPUT CIRCUIT
5
FN7690.2
March 15, 2013
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