EMIF6-100FC(2003) Ver la hoja de datos (PDF) - Protek Devices
Número de pieza
componentes Descripción
Lista de partido
EMIF6-100FC Datasheet PDF : 5 Pages
| |||
EMIF6-100FC
APPLICATION INFORMATION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
50/50 By Volume
No Clean
OSP(Entek Cu Plus 106A)
±50µm
±20µm
60 Seconds
240°C
FIGURE 5
RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
200°C
FIGURE 6
SOLDER REFLOW PROFILE
Instantaneous
to 200°C
225°C
5-10 sec
Note: This reflow profile does not take
into account the printed circuit board
(PCB) material heating time.
Additional time may be required for the
preheat time and cool down time upon
the PCB or board material.
100°C
1-2 Minutes
to 150°C
Pre-Heat
Time
1-2 Minutes to 25°C
Soldering
Time
Cool Down
Time
05190.R1 9/03
4
www.protekdevices.com
Share Link: 