MAX2022ETX(2013) Ver la hoja de datos (PDF) - Maxim Integrated

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MAX2022ETX
(Rev.:2013)

High-Dynamic-Range, Direct Up/Downconversion 1500MHz to 3000MHz Quadrature Modulator/Demodulator

Maxim Integrated 

MAX2022

High-Dynamic-Range, Direct Up/

Downconversion 1500MHz to 3000MHz

Quadrature Modulator/Demodulator

Absolute Maximum Ratings

VCC_ to GND........................................................-0.3V to +5.5V

BBIP, BBIN, BBQP, BBQN to GND........... -2.5V to (VCC + 0.3V)

LO, RF to GND Maximum Current......................................50mA

RF Input Power...............................................................+20dBm

Baseband Differential I/Q Input Power............................+20dBm

LO Input Power...............................................................+10dBm

RBIASLO1 Maximum Current.............................................10mA

RBIASLO2 Maximum Current.............................................10mA

RBIASLO3 Maximum Current.............................................10mA

Continuous Power Dissipation (Note 1)...............................7.6W

Operating Case Temperature Range (Note 2).... -40°C to +85°C

Maximum Junction Temperature......................................+150°C

Storage Temperature Range............................. -65°C to +150°C

Lead Temperature (soldering, 10s).................................. +300°C

Soldering Temperature (reflow)........................................+260°C

Note 1: Based on junction temperature TJ = TC + (θJC x VCC x ICC). This formula can be used when the temperature of the exposed

pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction

temperature must not exceed +150°C.

Note 2: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics

TQFN

Junction-to-Ambient

Thermal Resistance (θJA) (Notes 3, 4)......................+34°C/W

Junction-to-Case

Thermal Resistance (θJC) (Notes 1, 4).....................+8.5°C/W

Note 3: Junction temperature TJ = TA + (θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is

known. The junction temperature must not exceed +150°C.

Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

DC Electrical Characteristics

(MAX2022 Typical Application Circuit, VCC = 4.75V to 5.25V, VGND = 0V, I/Q ports terminated into 50Ω to GND, LO and RF ports

terminated into 50Ω to GND, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, TC = -40°C to +85°C, unless otherwise noted. Typical values are at

VCC = 5V, TC = +25°C, unless otherwise noted.)

PARAMETER

SYMBOL

CONDITIONS

MIN TYP MAX UNITS

Supply Voltage

Total Supply Current

Total Power Dissipation

VCC

4.75 5.00 5.25

V

ITOTAL Pins 3, 13, 15, 31, 33 all connected to VCC

292 342

mA

1460 1796 mW

Recommended AC Operating Conditions

PARAMETER

RF Frequency

LO Frequency

IF Frequency

LO Power Range

SYMBOL

fRF

fLO

fIF

PLO

(Note 5)

(Note 5)

(Note 5)

CONDITIONS

MIN TYP MAX UNITS

1500

3000 MHz

1500

3000 MHz

1000 MHz

-3

+3

dBm

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